Vacuum coating equipment, the company said in PVD technology development at the same time, the temperature in the PVD coating, PVD coating at low temperature and low pressure PVD coating also appeared, aims to reduce the deposition temperature, reduce the brittle phase interface, reduce the dosage of reaction gas, to realize automatic control, improve the quality of the coating. PVD coating has used its easy to control the characteristics of chemical composition on the coating type and structure have also made new development.
Magnetron sputtering deposition technology it compare the performance of a single, TiC coating or TIN, a significant increase. In 1978, on the basis of the above coating increases the better chemical stability of Al2O3 coating, thickness can be up to 10 mp, still have good adhesion strength of hard coating. Current PVD coating to the preparation of hard membrane of dozens of kinds of types and preparation of more than three layers of multilayer film and gradient film.
The main characteristics of the magnetron sputtering deposition technology is PVD deposition technology to further improve and expand the application scope, plasma activation of gas phase chemical deposition (PVD coating technology, basic research began to take off and is becoming more and more attention.
PVD vacuum coating is characterized by the physical process of glow discharge and chemical vapor deposition, so have the PVD low temperature resistance and PVD coating around the plating, and easy to adjust the chemical composition and structure of performance, it has the potential to replace PVD and PVD coating process some of the coating.
没有评论:
发表评论